Renesas Emulation Pod M3062PT3-RPD-E Informacje Techniczne Pobierz pdf (Strona 23)

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Chapter 2. Preparation

This chapter describes the package components, the system configuration and the preparation for using this product for the

first time.

2.1 Package Components................................................................................................................... 22

2.2 Other Tool Products Required for Development......................................................................... 22

2.3 Name of Each Part ....................................................................................................................... 23

(1) System Configuration ........................................................................................................... 23

(2) Inside of the Emulation Pod.................................................................................................. 24

2.4 When Using This Product for the First Time .............................................................................. 25

(1) Making the MCU File........................................................................................................... 25

(2) Setting the Work Area .......................................................................................................... 25

(3) Downloading Firmware ........................................................................................................26

(4) Self-check ............................................................................................................................. 26

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Renesas Emulation Pod M3062PT3-RPD-E Informacje Techniczne Strona 23