Renesas Single-Chip Microcomputer M37900T2-RPD-E Informacje Techniczne Pobierz pdf (Strona 17)

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Chapter 2. Preparation

This chapter describes the package components, the system configuration and the preparation for using this product for the

first time.

2.1 Terminology ............................................................................................................................... 16

2.2 Package Components.................................................................................................................. 17

2.3 Other Tool Products Required for Development........................................................................ 17

2.4 System Configuration ................................................................................................................. 18

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Renesas Single-Chip Microcomputer M37900T2-RPD-E Informacje Techniczne Strona 17