Renesas R8C/15 Instrukcja Użytkownika

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Rev.0.10 Mar 4, 2004 Page 1 of 16
REJ03B0078-0010Z
PRELIMINARY
R8C/15 Group
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Notice: This is not a final specification.
Some parametric limits are subject to change.
1. Overview
This MCU is built using the high-performance silicon gate CMOS process using a R8C/Tiny Series CPU
core and is packaged in a 20-pin plastic molded SSOP or SDIP. This MCU operates using sophisticated
instructions featuring a high level of instruction efficiency. With 1M bytes of address space, it is capable of
executing instructions at high speed.
The data flash ROM (1 KB X 2 blocks) is embedded.
1.1 Applications
Electric household appliance, office equipment, housing equipment (sensor, security), general industrial
equipment, audio, etc.
REJ03B0078-0010Z
Rev.0.10
Mar 4, 2004
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Podsumowanie treści

Strona 1 - PRELIMINARY

Rev.0.10 Mar 4, 2004 Page 1 of 16REJ03B0078-0010ZPRELIMINARYR8C/15 GroupSINGLE-CHIP 16-BIT CMOS MICROCOMPUTERNotice: This is not a final specification

Strona 2 - 1.2 Performance Outline

Rev.0.10 Mar 4, 2004 Page 10 of 16REJ03B0078-0010ZUnder development R8C/15 Group 2. Central Processing Unit (CPU) Preliminary specificationSpecicati

Strona 3 - 1.3 Block Diagram

Rev.0.10 Mar 4, 2004 Page 11 of 16REJ03B0078-0010ZUnder development R8C/15 Group 3. Memory Preliminary specificationSpecications in this manual are

Strona 4 - °C to 85 °C

Rev.0.10 Mar 4, 2004 Page 12 of 16REJ03B0078-0010ZUnder development R8C/15 Group 4. Special Function Register (SFR) Preliminary specificationSpecica

Strona 5 - 1.5 Pin Configuration

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Strona 6 - R8C/15 Group

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Strona 7 - 1.6 Pin Description

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Strona 8 - Under development

Rev.0.10 Mar 4, 2004 Page 16 of 16REJ03B0078-0010ZR8C/15 Group Package DimensionsUnder development Preliminary specificationSpecications in this manua

Strona 9

A - 1REVISION HISTORY R8C/15 Group Short SheetRev. DateDescriptionPage Summary0.10 Mar 4, 2004 - First Edition issued

Strona 10 - 2.8.10 Reserved Area

Keep safety first in your circuit designs!1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more relia

Strona 11 - Figure 3.1 Memory Map

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Strona 12 - REJ03B0078-0010Z

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Strona 17 - Page Summary

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Strona 18 - RENESAS SALES OFFICES

Rev.0.10 Mar 4, 2004 Page 9 of 16REJ03B0078-0010ZUnder development R8C/15 Group 2. Central Processing Unit (CPU) Preliminary specificationSpecicatio

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