Renesas M3062PT2-EPB Instrukcja Użytkownika Pobierz pdf (Strona 76)

M3062PT2-EPB User’s Manual 4. Hardware Specifications

R20UT0211EJ0300 Aug 16, 2012 Page 76 of 104

Rev.3.00

Figure 4.2 Memory expansion mode and microprocessor mode (2 wait, accessing external area, using multiplex bus)

Read timing

Write timing

BCLK

CSi

ADi

BHE

ALE

ADi

/DBi

td(BCLK-CS)

th(BCLK-CS)

tcyc

td(BCLK-AD)

th(BCLK-AD)

th(RD-CS)

td(BCLK-ALE)

th(BCLK-ALE)

th(RD-AD)

td(BCLK-RD)

th(BCLK-RD)

tac3(RD-DB)

Hi-Z

tsu(DB-RD)

th(RD-DB)

BCLK

CSi

ADi

BHE

ALE

WR,

WRL,WRH

ADi

/DBi

td(BCLK-CS)

th(BCLK-CS)

tcyc

td(BCLK-AD)

td(BCLK-ALE)

th(BCLK-ALE)

th(WR-AD)

td(BCLK-WR)

th(BCLK-WR)

td(BCLK-DB)

td(DB-WR)

th(BCLK-AD)

th(WR-CS)

th(WR-DB)

th(BCLK-DB)

td(AD-ALE) th(ALE-AD)

td(AD-RD)

tdz(RD-AD)

td(AD-ALE) th(ALE-AD)

td(AD-WR)

1 2 ... 71 72 73 74 75 76 77 78 79 80 81 ... 103 104

M3062PT2-EPB 1
Preface 3
Important 4
WARNING 7
Contents 9
Rev.3.00 10
User Registration 11
Terminology 12
1. Outline 13
1.3 System Configuration 15
System status 16
Target status 16
IMPORTANT 17
1.4 Specifications 18
CE Certifications: 19
FCC Certifications: 20
2. Setup 21
2.8 Self-check 29
M3T-FLX160-EPB 35
J1-4：GND 48
J1-3：Oscillator output 48
J1-2：GND 48
J1-1：VCC 48
3.2 Editor (Source) Window 59
3.4 Trace Window 68
3.5 RAM Monitor Window 71
4. Hardware Specifications 72
4.2 Access Timing 73
Write timing 74
4.4 Connection Diagrams 86
4.5 External Dimensions 88
MADE I N JAPAN 89
5. Troubleshooting 95
6. Maintenance and Warranty 100
CAUTION 101
Colophon 1.3 103
User’s Manual 104

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