Renesas Emulation Pod M306H2T-RPD-E Informacje Techniczne Pobierz pdf (Strona 24)

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* Please keep the M306H3T3-RPD-E's packing box and cushion material in your place for reuse

at a later time when sending your product for repair or other purposes. Always use these packing

box and cushion material when transporting this product.

* If there is any question or doubt about the packaged product, contact your local distributor.

2.2 Other Tool Products Required for Development

To bring forward programs development on an M306H3 MCU of the M16C/6H Group , the products

listed below are necessary in addition to those contained package above. Get them separately.

Table 2.2 Other tool products

* To purchase these products, contact your local distributor.

Chapter 2. Preparation

2.1 Package Components

The M306H3T3-RPD-E package consists of the following items. When unpacking, check to see if

your M306H3T3-RPD-E contains all of these items.

Table 2.1 Package components

Emulator main unit

Emulator debugger

PC4701 (excluding PC4700L and PC4701L)

M3T-PD30

Item

M306H3T3-RPD-E emulation pod main unit

FLX120-RPD flexible cable for connecting PC4701

F160-PRB converter board for M3T-FLX160C (preinstalled)

OSC-3 10 MHz oscillator circuit board for main clock (preinstalled)

OSC-2 oscillator circuit board (bare board)

M306H2T-PTC converter board for connecting 116-pin 0.65-mm-pitch (116PA-A) foot

pattern (including YQPACK116SB x1, NQPACK116SB x1 and YQ-Guide x4)

Network resistors for pulling up ports P0 to P5 (51 kΩ x8)

Hardware tool user registration FAX sheet (English)

Hardware tool user registration FAX sheet (Japanese)

Repair request sheet (English)

Repair request sheet (Japanese)

M306H3T3-RPD-E User's Manual (This manual)

M306H3T3-RPD-E User's Manual (Japanese)

Quantity

1 2 ... 19 20 21 22 23 24 25 26 27 28 29 ... 75 76

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Renesas Emulation Pod M306H2T-RPD-E Informacje Techniczne Strona 24