Renesas TBP-112 Informacje Techniczne Pobierz pdf (Strona 18)

2.3 Recommended Dimensions for User System Mount Pad

Figure 7 shows the recommended dimensions for the mount pad (footprint) for the user system with

an IC socket for an TBP-112 package (CSPACK112A1110H01: socket (manufactured by Tokyo

Eletech Corporation). Note that the dimensions in figure 7 are somewhat different from those of the

actual chip's mount pad.

Figure 7 Recommended Dimensions for Mount Pad

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