Renesas H8S/2237 Series Informacje Techniczne Pobierz pdf (Strona 20)

2.3 Recommended Dimensions for User System Mount Pad

Figure 6 shows the recommended dimensions for the mount pad (footprint) for the user system with

an IC socket for an TFP-100G package (NQPACK100SE: manufactured by Tokyo Eletech

Corporation). Note that the dimensions in figure 6 are somewhat different from those of the actual

chip's mount pad.

Unit: mm

0.40 ± 0.05 0.20 ± 0.05

0.40 × 24 = 9.60 ± 0.05

11.10 (max.)

15.10 (min.)

0.40 ± 0.05

Figure 6 Recommended Dimensions for Mount Pad

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