Renesas EDK3687 Informacje Techniczne Strona 5
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1. TABLE OF CONTENTS
1.
TABLE OF CONTENTS ............................................................................................................................................. 3
2. START-UP INSTRUCTIONS ....................................................................................................................................... 4
2.1. INSTALLING THE EVALUATION DEVELOPMENT KIT (EDK)........................................................................... 4
2.2. SERIAL CONNECTION....................................................................................................................................... 4
2.3. POWER SUPPLY ................................................................................................................................................ 4
3. EDK BOARD LAYOUT ............................................................................................................................................ 5
3.1. EDK BLOCK DIAGRAM....................................................................................................................................... 5
4. EDK OPERATION................................................................................................................................................... 6
4.1. USER INTERFACE.............................................................................................................................................. 6
4.2. SERIAL INTERFACE........................................................................................................................................... 6
4.3. SPI EEPROM....................................................................................................................................................... 7
4.4. I2C EEPROM....................................................................................................................................................... 8
4.5. LIN INTERFACE .................................................................................................................................................. 8
4.6. LEDS.................................................................................................................................................................... 8
5. BOARD OPTIONS.................................................................................................................................................... 9
5.1. JUMPER LINKS................................................................................................................................................... 9
5.2. EDK OPTIONS – CJ4........................................................................................................................................ 10
5.3. OPTION LINK SELECTION............................................................................................................................... 11
5.4. FLASH PROGRAMMING HEADER .................................................................................................................. 12
5.5. EXTERNAL DEBUG HEADER .......................................................................................................................... 12
5.6. BOOT CONTROL .............................................................................................................................................. 12
6. MICROCONTROLLER HEADER CONNECTIONS......................................................................................................... 13
6.1. HEADER J1 ....................................................................................................................................................... 13
6.2. HEADER J2 ....................................................................................................................................................... 13
7. CODE DEVELOPMENT ........................................................................................................................................... 14
7.1. HMON ................................................................................................................................................................ 14
7.2. ADDITIONAL INFORMATION ........................................................................................................................... 16
3
- To our customers 1
- SER MANUAL 3
- OR H8/3687 3
- N-CHIP FLASH MICROCONTROLLER 3
- Preface 4
- Cautions 4
- Trademarks 4
- Document Information 4
- 1. TABLE OF CONTENTS 5
- 2. START-UP INSTRUCTIONS 6
- 3. EDK BOARD LAYOUT 7
- 4. EDK OPERATION 8
- 4.2.2. CRYSTAL CHOICE 9
- 4.3. SPI EEPROM 9
- 4.4. I2C EEPROM 10
- 4.5. LIN INTERFACE 10
- 4.6. LEDS 10
- 5. BOARD OPTIONS 11
- 5.2. EDK OPTIONS – CJ4 12
- 5.3. OPTION LINK SELECTION 13
- 5.3.1. RST – RESET FUNCTION 13
- 5.3.2. LIN – LIN INTERFACE 13
- 5.5. EXTERNAL DEBUG HEADER 14
- 5.6. BOOT CONTROL 14
- 6.1. HEADER J1 15
- 6.2. HEADER J2 15
- 7. CODE DEVELOPMENT 16
- 7.1.4. MEMORY MAP 17
- 7.1.5. BAUD RATE SETTING 18
- 7.2. ADDITIONAL INFORMATION 18
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