Renesas Single-Chip Microcomputer M37900T2-RPD-E Informacje Techniczne Pobierz pdf (Strona 15)

( 13 / 52 )

Chapter 2. Preparation

This chapter describes the package components, the system configuration and the preparation for using this product for the

first time.

2.1 Terminology ............................................................................................................................... 14

2.2 Package Components.................................................................................................................. 15

2.3 Other Tool Products Required for Development........................................................................ 15

2.4 Name of Each Part...................................................................................................................... 16

(1) System Configuration ........................................................................................................... 16

(2) Inside of the Emulation Pod.................................................................................................. 17

2.5 When Using the Emulator for the First Time ............................................................................. 18

1 2 ... 10 11 12 13 14 15 16 17 18 19 20 ... 53 54

Brak uwag

Renesas Single-Chip Microcomputer M37900T2-RPD-E Informacje Techniczne Strona 15