Renesas Emulation Pod M306H2T-RPD-E Informacje Techniczne Pobierz pdf (Strona 23)

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Chapter 2. Preparation

This chapter describes the package components, the system configuration and the preparation for using this product for the

first time.

2.1 Terminology ............................................................................................................................... 22

2.2 Package Components.................................................................................................................. 23

2.3 Other Tool Products Required for Development........................................................................ 23

2.4 Name of Each Part...................................................................................................................... 24

(1) System Configuration ........................................................................................................... 24

(2) Inside of the Emulation Pod.................................................................................................. 25

2.5 When Using the Emulator for the First Time ............................................................................. 26

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