Renesas Emulation Pod M3062PT3-RPD-E Instrukcja Użytkownika Pobierz pdf (Strona 132)

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Rev.1.00 2004.06 Page 132 of 135

LCC

Leadless Chip Carrier (QFN: Quad Flat Non-leaded Package)

LCCSocket

IC socket used to connect an LCC package MCU to a QFP

package foot target.

LQFP

Low profile Quad Flat Package

MCP

Multi Chip Package

Mold CSP

Mold Chip Size/Scale Package

NQPACK (made by Tokyo Eletech Co., Ltd.)

Board that is mounted on the target system's foot pattern and used

to connect to the emulator via the NQSOCKET (male side).

NQSOCKET (made by Tokyo Eletech Co., Ltd.)

Socket used to connect NQPACK and board (female side).

Overmold BGA

Overmold Ball Grid Array

PC4701

The PC4701 is a generic name representing the PC4701U,

PC4701M, PC4701HS, PC4701L, PC4700H, and PC4700L.

Production of the PC4701M, PC4701HS, PC4701L, PC4700H

and PC4700L has been discontinued.

PC4816

The PC4816 is a generic name representing the PC4816B,

PC4816A and PC4816. Production of thePC4816B, PC4816A

and PC4816 has been discontinued.

QFP

Quad Flat Package

RFS

QFP/LCC package emulator MCU

RSS

DIP package emulator MCU

SDIP

Shrink Dual Inline Package

Smart BGA

Smart Ball Grid Array

SMCP

Stacked Multi Chip Package

Appendix I

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