Renesas Emulation Pod for M30240 Group MCUs M30240T-RPD-E Informacje Techniczne Pobierz pdf (Strona 17)

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Chapter 2. Preparation

This chapter describes the package components, the system configuration and the preparation for using this product for the

first time.

2.1 Terminology ............................................................................................................................... 16

2.2 Package Components.................................................................................................................. 17

2.3 Other Tool Products Required for Development........................................................................ 17

2.4 Name of Each Part...................................................................................................................... 18

(1) System Configuration ........................................................................................................... 18

(2) Inside of Emulation Pod ....................................................................................................... 19

2.5 When Using the Emulator for the First Time ............................................................................. 20

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Renesas Emulation Pod for M30240 Group MCUs M30240T-RPD-E Informacje Techniczne Strona 17