Renesas SH7050 Series Instrukcja Użytkownika Pobierz pdf (Strona 21)

2.4 Recommended Dimensions for User System Mount Pad (Footprint)

Figure 5 shows the recommended dimensions for the mount pad (footprint) for the user system

with an IC socket for an BP-272 package (CSPACK256Z2021H01: manufactured by Tokyo

Eletech Corporation). Note that the dimensions in figure 6 are somewhat different from those of

the actual chip's mount pad.

Unit: mm

1.0 x 19 = 19.0

4-Ø1.3

Through hole

1.0

21.3

23.0 ± 0.03

Ø0.5

Figure 5 Recommended Dimensions for Mount Pad

1 2 ... 16 17 18 19 20 21 22 23 24 25 26 27 28

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